011LAB Technology
We are utilizing high technology to create innovative new Internet of Things (IoT) and other products and solutions. Within our work and experience we have been familiarized with many state of the art technologies and cutting edge concepts, processes and certifications:
Bluetooth, BLE - Bluetooth LE - Bluetooth Low Energy (also known as Bluetooth Smart), Zigbee, LoRa-WAN, 6LoWPAN, Thread, Z-Wave, WiFi (802.11a/b/g/n), NarrowBand IoT (NB-IoT), GSM/GPRS/EDGE/UMTS/HSDPA/HSPA+/LTE
ADC, DAC, I/O Modules, Sensors, Modulation, Demodulation, RF, Amplification, Filtering, Signal Processing, Cameras, Frame Grabbers, Power Electronics, SMPS (Switch Mode Power Supply), DC/DC Coverters, AC/DC Converters, MEMS/MST (Micro-Electro-Mechanical Systems/Micro Systems Technology) Components
uC (µC - Microcontrollers), uP (µP - Microprocessors), DSP (Digital Signal Processors), Application Processors, FPGA, CPLD, OS-less, RTOS, Linux, Windows
Rigid, Flex (Flexible), Multi-layer, Hi-Speed, Power Management, Thermal Management, DFA (Design for Assembly), DFM (Design for Manufacturability), DFQ (Design for Quality), DFR (Design for Reliability), DFS (Design for Safety), DFT (Design for Test)
USB3.0, USB2.0, USB, PCIe (PCI Express), PCI, EISA, Gigabit Ethernet (IEEE 802.3-2008), Ethernet 10/100 Mbit (IEEE 802.3), RS-232, RS-485, LPT, SPI, I2C, LVDS
RFID, NFC, ISO/IEC 14443A&B, IrDA, Bluetooth, BLE - Bluetooth LE - Bluetooth Low Energy (also known as Bluetooth Smart), Zigbee, LoRa-WAN, 6LoWPAN, Thread, Z-Wave, WiFi (802.11a/b/g/n), WiMAX (IEEE 802.16e-2005), GSM/GPRS/EDGE/UMTS/HSDPA/HSPA+/LTE, NarrowBand IoT (NB-IoT)
TFT LCD, LCD, Touch Screen, Mechanical/Electrical/RF/Optical
Chemistries: Li-Ion, Li-Polymer, NiMH, Thermal Management, Fuel Gauge
USA NAVSTAR GPS - Global Positioning System and the Russian GLONASS
Positioning, Time Synchronization, Geolocation, Navigation
Illumination, Imaging, Digital Image Processing, Optics
Imaging Systems Illumination, General Purpose Illumination, LED, OLED, Mono-Spectral, Multi-Spectral, Hyper-Spectral, White, Infrared, NIR (Near Infrared), Ultraviolet
CMOS/CCD, Area Imagers, Line Imagers, Mono/Color/NIR
Digital Image Processing and Image Analysis Algorithms (Classification, Feature extraction, Pattern recognition, Multi-Scale Signal Analysis)
Filters, Lenses, Mirrors, Prisms, FSMs (First Side Mirrors), Beam Splitters, Coatings
Aesthetics, HF&E (Human Factors and Ergonomics), Functionality, Form/Materials/Texture/Colors, Usability, Health/Safety, Productivity, 3D Modeling, GUI Design, Branding
3D CAD Engineering, Rapid Prototyping (STL - Stereolithography, FDM - Fuse Deposition Mold, SLS - Selective Laser Sintering, Vacuum Casting), Injection Molding, Sheet Metal, New Materials, Thermal Management, EMC Considerations, DFMA (Design for Manufacture and Assembly), Design for Maintenance
Automated Continuous Integration with Revision Control and Build Automation, Cross-Platform, Multi-Platform, Microsoft Windows (x86, x86-64, ARM), Linux (x86, x86-64, PowerPC, and other architectures), Mac OS X (x86, x86-64), Android, iOS
Holistic and Interdisciplinary Approach, MDE (Multi-disciplinary Engineering), Managing Complexity, Reliability/Availability, Safety
ISO 9001:2008 - Quality Management System
Products Certifications: Europe (CE, EMC Directive, LVD Directive, RoHS Directive, WEEE Directive, GPSD - General Product Safety Directive), USA (UL, FCC)